INTERDENTAL EXCESSES REMOVAL AND ORTHODONTIC STRIPPING PERFORMANCE

Hack-saw frame designed to remove excesses of composites,adhesives, cements and amalgams from proximal areas.Indicated for Inlay and Onlay procedures and laminatedveneers.Easy and safe way to remove surplus materials withoutdamaging the contact points.

Main Benefits

• Saw blade removes excesses of any type of filling materialsfrom the interproximal areas, without breaking the contactpoint due its thickness of only 0,05mm
• Diamond strips allows to perform the stripping inorthodontic procedures
• Easy and safe handling
• All components are autoclavable

Presentations